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CLADDING · BIMETAL PRODUCT · BIMETAL PRESSURE VESSEL TECHNICAL STUDY

Finite Element Simulation of Temperature Field in Strip Electrode Submerged Arc Welding of Thick Plates

Literature Overview

This paper, published in the Journal of Welding (焊接学报) in 2009, was authored by Wang Zhifeng, Chen Peiyin, Wu Wei, Chen Yan from the Harbin Welding Research Institute of the Chinese Academy of Mechanical Sciences, together with Chen Jianmin and Bao Hong from China First Heavy Industries Group Co., Ltd. The work addresses the critical challenge of predicting thermal behavior during strip electrode submerged arc welding (SESAW) applied to thick plate cladding operations, a process widely used in the fabrication of large-diameter pressure vessels, hydrogenation reactor shells, and heavy equipment components.

The significance of this research lies in the fact that thick plate cladding—typically involving base plate thicknesses exceeding 50 mm and requiring multiple layers of overlay—presents unique thermal management challenges. Incongruities between the heat input of strip electrode processes (which can exceed 30 kJ/mm) and the thermal mass of thick substrates can lead to excessive residual stresses, distortion, and potential cracking in the cladding layers. Finite element simulation provides a quantitative tool to optimize preheating strategies, interpass temperature control, and multi-pass sequencing before committing to expensive full-scale trials.

Core Technical Approach

The authors employed a three-dimensional finite element model to simulate the transient temperature field during strip electrode submerged arc welding of thick plates. The methodology involves coupling a moving heat source with thermophysical properties that vary with temperature, accounting for the complex thermal gradients inherent in multi-pass cladding on thick substrates.

Key Modeling Parameters

Parameter Typical Range Description
Base plate thickness 50–150 mm Thick plate cladding applications
Strip electrode width 40–80 mm Standard strip electrode dimensions
Current density 150–250 A/mm Strip electrode operating range
Welding speed 150–300 mm/min Linear travel speed
Heat input 25–45 kJ/mm Total process heat input
Preheat temperature 150–350 °C Depends on material and thickness
Interpass temperature 150–300 °C Maximum allowed between passes
Thermal conductivity 25–50 W/(m·K) Temperature-dependent
Specific heat 450–800 J/(kg·K) Temperature-dependent
Melting temperature 1450–1550 °C Base metal / overlay interface

Heat Source Model

The strip electrode heat source is modeled as a distributed rectangular or elliptical heat source rather than a point source, reflecting the extended contact area between the strip electrode and the workpiece. This is fundamentally different from conventional submerged arc welding with wire electrodes, where a concentrated heat source model is more appropriate. The rectangular distribution accounts for the uniform deposition width characteristic of strip electrode processes.

The governing heat equation solved in the simulation is:

ρ·Cp·(∂T/∂t) = ∇·(k·∇T) + Q(x,y,t)

where ρ is density, Cp is specific heat capacity, k is thermal conductivity (all temperature-dependent), and Q represents the distributed heat source intensity.

Process Analysis and Engineering Implications

Multi-Pass Thermal Accumulation

One of the most critical findings emphasized in the paper is the cumulative thermal effect during multi-pass cladding. As successive layers are deposited, the thermal mass of previously deposited material increases, leading to progressive elevation of the base metal temperature at the cladding interface. This has several engineering consequences:

  1. Residual stress evolution: The differential cooling rates between the hot overlay layers and the cooler base plate generate significant residual tensile stresses in the cladding, which can approach or exceed the yield strength of austenitic stainless steel overlays (304, 316) at room temperature.
  2. Microstructural transformation: In the heat-affected zone of carbon steel base plates, excessive interpass temperatures can promote the formation of soft, ductile microstructures (coarse ferrite and pearlite) that reduce hardness and potentially compromise mechanical properties in the base metal.
  3. Bond strength concerns: While moderate interpass temperatures generally promote good metallurgical bonding between the overlay and base metal, excessively high temperatures can lead to excessive dilution and the formation of martensitic phases at the interface in certain alloy combinations.

Preheating Strategy Optimization

The simulation results provide guidance for preheating temperature selection. For carbon steel base plates with thickness exceeding 80 mm, preheating to 200–250 °C is recommended to reduce thermal gradients and minimize the risk of hydrogen-induced cracking in the base metal HAZ. However, for stainless steel overlays, excessively high preheat temperatures (above 350 °C) can promote sensitization in the overlay layer, particularly for austenitic grades such as 304 or 316, leading to reduced corrosion resistance.

Comparison with Conventional Wire Electrode SAW

Aspect Strip Electrode SAW Wire Electrode SAW
Deposition rate 5–10 kg/h 1–2 kg/h
Heat input per pass 25–45 kJ/mm 5–15 kJ/mm
Dilution control Lower per-pass dilution Higher per-pass dilution
Layer uniformity Excellent Good
Equipment complexity Higher Lower
Suitable plate thickness 20–200 mm 5–100 mm
Typical overlay thickness per pass 3–5 mm 2–4 mm
Number of passes (10 mm overlay) 3–5 8–15

Key Questions and Reflections

The paper raises important considerations for engineers working on thick plate cladding projects. First, the validity of finite element predictions depends heavily on the accuracy of temperature-dependent thermophysical property data, particularly for multi-layer systems where the properties of the overlay material may differ significantly from the base metal. Second, the simulation typically assumes perfect thermal contact at the interface, which may not reflect reality in cases where interfacial oxide films or porosity exist.

From a practical standpoint, I would emphasize that while finite element simulation provides invaluable guidance for process planning, it must be validated against thermocouple measurements from actual weld trials. The thermal coupling between adjacent passes in a multi-layer cladding sequence is particularly difficult to predict accurately, and the simulation should be used as a decision-support tool rather than a definitive predictor.

Another reflection concerns the applicability of these findings to different overlay materials. The thermal behavior of nickel-based alloy overlays (Inconel 625, Hastelloy C276) differs markedly from austenitic stainless steel overlays due to lower thermal conductivity and higher specific heat, leading to steeper thermal gradients and potentially higher residual stresses. Engineers should not directly extrapolate simulation parameters developed for stainless steel overlays to nickel-based systems without recalibration.

Study Insights and Practical Implications

The most valuable contribution of this work is the systematic demonstration that finite element simulation can effectively predict peak temperatures, thermal gradients, and cooling rates during strip electrode cladding of thick plates. These predictions enable engineers to:

For pressure vessel fabrication specifically, the ability to predict and control residual stresses in clad plate is essential for meeting the requirements of ASME VIII Div.1 and GB/T 150 regarding stress relief and dimensional tolerances. The simulation approach described here provides a quantitative basis for establishing welding procedure specifications (WPS) that are both technically sound and economically efficient.

In conclusion, this paper represents a mature application of computational methods to a practical welding engineering problem, demonstrating that finite element analysis can significantly reduce the trial-and-error costs associated with thick plate cladding process development while improving the predictability and reliability of the final product.